Power-electronics substrates, RF feedthroughs, LED carriers, vacuum components, semiconductor fixtures — electronics specifies ceramics for thermal management, dielectric isolation and dimensional precision. Anderman supplies aluminium nitride, dense alumina, boron nitride and quartz to substrate, package and process equipment manufacturers.
Standard, mid-thermal-conductivity and high-thermal-conductivity AlN substrates from one supplier — sized from prototype coupons to full panel formats, with the tolerance and surface finish that AMB and DBC processing requires.
Dense alumina, AlN, BN and quartz machined and polished to electronics-package tolerances — typically ±10 µm on critical features, surface roughness to sub-micron Ra where polish matters.
Direct routes to metallised alumina, brazed metal-ceramic assemblies and DBC/AMB substrate manufacturing through partner network. We connect substrate to assembled component when you need that path.
AlN dominates as the substrate ceramic for IGBT, MOSFET and SiC-power modules — thermal conductivity 170–220 W/m·K matched to a CTE close to silicon, eliminating the thermal-cycling failures that plagued alumina substrates. Anderman supplies AlN substrates as bare ceramic, metallised, DBC or AMB through partner manufacturing. For lower-power modules, dense alumina (96–99.5%) remains the cost-effective baseline.
Dense alumina (EA995/EA999) is the standard for RF feedthroughs, vacuum windows, microwave dielectric resonators and traveling-wave-tube components. AlN is specified for high-power RF amplifier substrates where heat dissipation dominates. For very high-frequency or low-loss applications, quartz and specialty ceramics extend the dielectric range.
AlN and dense alumina carry LED chips and laser-diode submounts — AlN where thermal flux is high (high-brightness LEDs, laser bars), alumina where cost matters more than peak performance. BN is specified for VCSEL and crystal-growth fixturing.
Semiconductor process equipment uses alumina, AlN and quartz for wafer chucks, susceptors, electrostatic-chuck dielectrics, plasma-chamber components, evaporation boats and crystal-growth crucibles. BN is the standard for ion-implant components and aluminium-evaporation boats.
AlN or alumina for an IGBT substrate?
Can you supply metallised alumina for hermetic packages?
What’s the right ceramic for an electrostatic chuck?
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Tell us the module class, package type or process step. We'll specify AlN, alumina, BN or quartz at the right grade, tolerance and finish — and route through metallisation, DBC, AMB or polishing partners as needed.
